The materials of tomorrow are here. But manufacturing hasn’t caught up.
K1’s platform technology changes that.
Today, the entire semiconductor ecosystem is built around silicon and scraping for marginal gains.
But breakthrough technologies demand more. In space, electric vehicles, defense systems, and AI data centers, silicon struggles with extreme heat, radiation, and voltage.
To push the boundaries of what’s possible, from mass EV adoption to high-performance AI, we need advanced semiconductors.
Next-generation materials unlock new frontiers in chip performance, voltage handling, heat dissipation, and efficiency. Yet today, they’re barely used.
Why? Because manufacturing with these materials is extremely complex and wasteful. Entire wafers are often discarded after a single use. Yields are low. Costs are astronomically high.
This is a bottleneck not driven by physics but by process limitations.
K1’s semiconductor wafer-splitting technology unlocks the full potential of high-performance materials, improving the efficiency and economics of next-gen chip manufacturing.
From PhDs to MBAs, K1 is led by a multidisciplinary team of scientists, engineers, and operators — backed by world-class advisors with decades of experience in semiconductor manufacturing, deep-tech commercialization, and venture investing.
The economic and national security of America depends on advanced semiconductors — and K1 is building the platform technology to power it.
Join us in shaping the future through joint research, technical pilots, co-development, and strategic investment.
© 2025 K1 Semiconductor, Inc.
